University at Albany’s College of Nanotechnology, Science, and Engineering (CNSE) offers a full suite of state-of-the-art 300mm and 200mm wafer processing and analytical technologies and offer studies in everything from nanoscience, engineering, business, nursing, cybersecurity, computer science, mathematics and humanities. AIM Photonics operates the Test Assembly and Packaging (TAP) facility for photonic integrated circuits in Rochester New York.
The CATN2 is housed at the Albany NanoTech Complex, a 1.65 million-square-foot megaplex with the only fully-integrated, 300mm computer chip pilot prototyping and demonstration lines within 135,000 square feet of Class 1 capable cleanrooms. Unmatched nanotechnology-centered educational resources and capabilities provide the foundation for New York’s burgeoning Tech Valley.
Albany Nanotech Complex is a fully-integrated research, development, prototyping, and educational facility that provides strategic support through outreach, technology acceleration, business incubation, pilot prototyping, and test-based integration support for onsite corporate partners including IBM, GlobalFoundries, Samsung, Applied Materials, Tokyo Electron, ASML and Lam Research, as well as other “next-generation” nanotechnology research activities.
NanoFab South, completed in March 2004, is a 150,000 square foot facility that includes 32,000 square feet of cleanroom space. The facility also includes classrooms, undergraduate and graduate student lounges and offices.
NanoFab 200 (also known as CESTM) was completed in June 1997. This 70,000 square foot facility includes 4,000 square feet of cleanroom space, plus SUNY Poly metrology labs and office space for programs such as the State University of New York’s Atmospheric Sciences Research Center.
The Zero Energy Nanotechnology (ZEN) building, completed in 2015, is SUNY Poly’s most recent expansion project, a 356,000-square-foot facility that serves as a living laboratory for clean and renewable energy technologies.
NanoFab Xtension, completed in 2013, is a 500,000-square-foot facility with 50,000 square feet of 300mm wafer cleanrooms.
NanoFab East, a 250,000-square-foot office, laboratory and classroom building and NanoFab Central, a separate 100,000-square-foot building that houses 15,000 square feet of 300mm wafer, class 1 capable cleanroom space were part of a project completed in March 2009.
NanoFab North, completed in December 2005, is a 228,000 square foot facility that includes 35,000 square feet of cleanroom space with Class 1 capable 300mm wafer production. The NFN facility also houses the world’s first extreme ultraviolet (“EUV”) Alpha Demo Tool, developed by ASML.
In sum, the 1.65 million square-foot NanoTech megaplex boasts billions of dollars in high-tech investments and hundreds of corporate partners to date, with thousands of R&D jobs on site.
The CATN2 serves as a gateway to the various services that are provided at the AIM Photonics’ TAP facility, the world’s first open 300mm state-of-the-art advanced ecosystem for integrated silicon photonics test, assembly, and packaging. Services include development and production process capability in key areas including wafer scale, chip scale and I/O attach and state-of-the-art Test and Metrology capabilities for each of these key functional areas.
The AIM Photonics TAP facility is the world's first open 300 mm, state-of-the-art advanced ecosystem for integrated silicon photonics test, assembly, and packaging. TAP stands for Test, Assembly, and Packaging. Our Facility is the world’s first 300mm open access PIC Test, Assembly, and Packaging Facility. What separates AIM Photonics TAP Facility from the rest? Our state of the art TAP facility is located in Rochester, NY, the world's capitol for Optics Photonics and Imaging (OPI). The Facility will have brand new strategically designed tool set and analytical lab for advancing next generation PIC technology. Being centrally located in the OPI capitol also provides partners access to a well established photonics supply chain.
Contact AIM Photonics to learn more.